Phase change random access memory and method for manufacturing the same

ABSTRACT

A phase change random access memory includes a semiconductor substrate having a bottom electrode formed over the semiconductor substrate; and a phase change layer formed over the bottom electrode. The phase change layer a first phase change layer formed over the bottom electrode and including at least one of a first element, a second element, and a third element; and a second phase change layer formed over a surface of the first phase change layer and formed of the first element to prevent an area of the first phase change layer from increasing through diffusion.

CROSS-REFERENCES TO RELATED APPLICATION

The present application claims priority under 35 U.S.C.§119(a) to Koreanapplication number 10-2011-0096810, filed on Sep. 26, 2011, in theKorean Intellectual Property Office, which is incorporated herein byreference in its entirety as set forth in full.

BACKGROUND

1. Technical Field

The present invention relates to a phase change random access memory(PRAM), and more particularly, to a phase change random access memoryand a method for manufacturing the same.

2. Related Art

In general, a phase change random access memory (PRAM) stores data usinga difference in resistance between an amorphous state and a crystallinestate, by applying an electrical pulse to a phase change layer formed ofa chalcogenide compound. The amorphous state of the phase change layeris obtained by applying a high current to increase the temperature of aphase change substance over a melting point and subsequently performinginstant-cooling. The crystalline state of the phase change layer isobtained by generating a nucleus from applying low current in theamorphous state and undergoing a growing process

Here, in the phase change random access memory, while change from theamorphous state into the crystalline state is easily implemented, changefrom the crystalline state into the amorphous state consumes largeoperating current.

In order to reduce operating current and improve reliability in thephase change random access memory, a method for forming a phase changelayer as a confined structure may be used.

In forming the confined structure, a phase change area in the form of ahole is defined through a damascene process instead of etching, and aphase change substance is filled in the phase change area to increasephase change efficiency.

In using the confined structure, if phase change substances have uniformcomposition ratios in the hole, operating current increases since aphase change area is wide, In general, the phase change layer is filledthrough chemical vapor deposition (CVD) or atomic layer deposition(ALD). In this regard, since a process is performed at a relatively hightemperature (around 300° C.), a phase change area is widened due tointeratomic diffusion and chemical reaction, and operating currentincreases.

Also, as the degree of integration of a phase change random accessmemory increases, the distance between cells decreases and disturbanceis caused due to heat so that the reliability of the phase change randomaccess memory deteriorates.

SUMMARY

A phase change random access memory in which a phase change substance isembedded at a low temperature to reduce operating current and improvethe reliability of a phase change random access memory and a method formanufacturing the same are described herein,

In one embodiment of the present invention, a phase change random accessmemory includes: a semiconductor substrate having a bottom electrodeformed over the semiconductor substrate; w and a phase change layerformed over the bottom electrode, wherein the phase change layerincludes a first phase change layer formed over the bottom electrode andincluding at least one of a first element, a second element, and a thirdelement; and a second phase change layer formed over a surface of thefirst phase change layer and formed of the first element to prevent anarea of the first phase change layer from increasing through diffusion.

In another embodiment of the present invention, a phase change randomaccess memory includes: a semiconductor substrate having a bottomelectrode formed over the semiconductor substrate; and a phase changelayer formed over the bottom electrode, wherein the phase change layerincludes a first phase change layer formed over the bottom electrode andincluding any one of a binary compound of a first element and a secondelement, a binary compound of the first element and a third element, anda binary compound of the second element and the third element; and asecond phase change layer formed over a surface of the first phasechange layer and including a binary compound of the first element andthe second element or a binary compound of the first element and thethird element, wherein the ratio of the first element in the secondphase change layer is such that an area of the first phase change layeris prevented from increasing through diffusion.

In another embodiment of the present invention, a phase change randomaccess memory includes: a semiconductor substrate having a bottomelectrode formed over the semiconductor substrate; and a phase changelayer formed over the bottom electrode, wherein the phase change layerincludes a first phase change layer formed over the bottom electrode andincluding a ternary compound of a first element, a second element and athird element; and a second phase change layer formed over a surface ofthe first phase change layer and formed of a ternary compound of thefirst element, the second element and the third element, wherein theratio of the first element is such that an area of the first phasechange layer is prevented from increasing through diffusion.

In another embodiment of the present invention, a method formanufacturing a phase change random access memory includes: forming abottom electrode over a semiconductor substrate; forming a first phasechange layer over the bottom electrode using at least one of a firstelement, a second element, and a third element; and forming a secondphase change layer over a surface of the first phase change layer usingthe first element.

In another embodiment of the present invention, a method formanufacturing a phase change random access memory includes: forming abottom electrode over a semiconductor substrate; forming a first phasechange layer over the bottom electrode using any one of a binarycompound of a first element and a second element, a binary compound ofthe first element and a third element, and a binary compound of thesecond element and the third element; and forming a second phase changelayer over a surface of the first phase change layer using a binarycompound of the first element and the second element or a binarycompound of the first element and the third element.

In another embodiment of the present invention, a method formanufacturing a phase change random access memory includes: forming abottom electrode over a semiconductor substrate; forming a first phasechange layer over the bottom electrode using a ternary compound of afirst element, a second element and a third element; and forming asecond phase change layer over a surface of the first phase change layerusing a ternary compound of the first element, the second element andthe third element.

BRIEF DESCRIPTION OF THE DRAWINGS

Features, aspects, and embodiments are described it conjunction with theattached drawings, in which:

FIGS. 1A to 1D are views illustrating a method for manufacturing a phasechange random access memory in accordance with an embodiment of thepresent invention; and

FIG. 2 is a table showing composition ratios of phase change layers inthe embodiment of the present invention.

DETAILED DESCRIPTION

Hereinafter, a phase change random access memory and a method formanufacturing the same according to the present invention will bedescribed below with reference to the accompanying drawings throughexemplary embodiments.

FIGS. 1A to 1D are views illustrating a method for manufacturing a phasechange random access memory in accordance with an exemplary embodimentof the present invention, and FIG. 2 is a table showing compositionratios of phase change layers in the exemplary embodiment of the presentinvention.

Referring to FIG. 1A, in the phase change random access memory inaccordance with the exemplary embodiment of the present invention, ajunction region 120 serving as a word line is formed on a semiconductorsubstrate 110, and a switching element 140 is formed on the junctionregion 120. As the switching element 140, a diode may be used without alimiting sense, or a MOS transistor may be used. Reference character 130denotes a first interlayer dielectric layer.

Referring to FIG. 1B, a second interlayer dielectric layer 150 isdeposited on the switching element 140, and a hole is defined by etchingthe second interlayer dielectric layer 150. Thereafter, by filling andrecessing titanium (Ti) or a titanium nitride (TiN) in the lower portionof the hole, a bottom electrode 150 is formed,

Referring to FIG. 1C, a phase change layer 170 constituted by germanium(Ge), antimony (Sb) and Tellurium (Te) is formed on the bottom electrode160 formed as described above. In the phase change random access memoryin accordance with the embodiment of the present invention, the phasechange layer 170 may be constituted by a first phase change layer 171and a second phase change layer 172. The first phase change layer 171and the second phase change layer 172 are formed to have differentcomposition ratios between elements of the layers.

The first phase change layer 171 serves as a programming volume for amemory, Here, a phase change substance of the first phase change layer171 may be selected such that the first phase change layer 171 has a lowmelting point and possesses a composition ratio enabling easy transitionfrom and to an amorphous state.

The second phase change layer 172 serves as a barrier region. Therefore,in order to prevent the first phase change layer 171 from spreadingthrough diffusion by heat, a phase change substance of the second phasechange layer 172 may be selected such that the second phase change layer172 has a high melting point and possesses a composition ratio to resultin a more difficult transition to and from an amorphous state and havinglow thermal conductivity. Referring to FIG. 2, it can be seen that aphase change substance for forming the second phase change layer 172includes germanium (Ge), This is because germanium (Ge) has a lowthermal conductivity among phase change substances.

Referring to FIG, 2, each of the first phase change layer 171 and thesecond phase change layer 172 may each be formed of, for example, onlyone phase change substance. For example, the first phase change layer171 may be formed of any one of germanium (Ge), antimony (Sb) andTellurium (Te), and the second phase change layer 172 may be formed ofonly germanium (Ge).

Further, each of the first phase change layer 171 and the second phasechange layer 172 may be constituted by a binary compound, where thebinary compound is formed of two phase change elements (that is, a firstphase change element and a second phase change element). According to anexample, the first phase change layer 171 may be formed of any one ofgermanium (Ge)-antimony (Sb), germanium (Ge)-Tellurium (Te) and antimony(Sb)-Tellurium (Te), and the second phase change layer 172 may be formedof any one of germanium (Ge)-antimony (Sb) and germanium (Ge)-Tellurium(Te). In the case where the binary compound of germanium (Ge)-antimony(Sb) is used, when germanium (Ge) has a composition ratio of 0.1 to 0.9(that is, 10% to 90%) and antimony (Sb) has a composition ratio of(1-germanium (Ge)), and in the case where the binary compound ofgermanium (Ge)-Tellurium (Te) is used, when germanium (Ge) has acomposition ratio of 0.5 to 0.9, tellurium (Te) has a composition ratioof (1-germanium (Ge)). In the case where the binary compound of antimony(Sb)-Tellurium (Te) is used, when antimony (Sb) has a composition ratioof 0.4 to 0.9, tellurium (Te) has a composition ratio of (1-antimony(Sb)). The composition ratio of germanium (Ge) may be set higher toensure the characteristics of the second phase change layer 172.

Moreover, each of the first phase change layer 171 and the second phasechange layer 172 may be constituted by a ternary compound. According toan example, each of the first phase change layer 171 and the secondphase change layer 172 is formed of germanium (Ge)-antimony(Sb)-Tellurium (Te). In the composition ratio thereof, for example, whengermanium (Ge) is set to 0.3 within a composition ratio of 0.01 to 0.5used for germanium in the ternary compound, assuming that antimony (Sb)is set to 0.5 within a composition ratio of 0.1 to 0.9 used for antimonyin the ternary compound, tellurium (Te) is set to 0.2 within acomposition ratio of 0.1 to 0.6 used for tellurium In the ternarycompound. In this way, the first phase change layer 171 and the secondphase change layer 172 have different composition ratios.

The phase change layer 170 is filled through chemical vapor deposition(CVD) or atomic layer deposition (ALD). As a low temperature processunder 200° C. is performed, the area of the first phase change layer171, that is, the area of the memory volume, may be prevented fromincreasing, whereby operating current can be reduced and the reliabilityof a phase change random access memory can be increased by decreasingdisturbance due to heat.

Referring to FIG. 1D, by planarizing or etching back the phase changelayer 170 formed in this way, the phase change layer 170 is formed tohave a confined structure.

A top electrode 180 is formed on the phase change layer 170 usingtitanium (Ti) or a titanium nitride (TIN).

By using the phase change random access memory and the method formanufacturing the same according to the embodiments of the presentinvention, the composition ratios of a phase change layer are set toprevent disturbance by heat and not to widen a phase change area (aprogramming random access memory area), whereby the reliability of aphase change random access memory can be increased.

While certain embodiments have been described above, they are exemplaryonly. Rather, the phase change random access memory and the method formanufacturing the same according to exemplary embodiments should includeany other reasonably suitable embodiments that are consistent with theabove-described features of the exemplary embodiments.

1-14. (canceled)
 15. A method for manufacturing a phase change randomaccess memory, comprising: forming a bottom electrode over asemiconductor substrate; forming a first phase change layer over thebottom electrode using at least one of a first element, a secondelement, and a third element; and forming a second phase change layerover a surface of the first phase change layer using the first element.16. The method according to claim 15, wherein the first element isgermanium (Ge), the second element is antimony (Sb) and the thirdelement is tellurium (Te).
 17. The method according to claim 15, whereinthe first phase change layer and the second phase change layer areformed at a low temperature equal to or lower than 200° C.
 18. A methodfor manufacturing a phase change random access memory, comprising:forming a bottom electrode over a semiconductor substrate; forming afirst phase change layer over the bottom electrode using any one of abinary compound of a first element and a second element, a binarycompound of the first element and a third element, and a binary compoundof the second element and the third element; and forming a second phasechange layer over a surface of the first phase change layer using abinary compound of the first element and the second element or a binarycompound of the first element and the third element.
 19. The methodaccording to claim 18, wherein the first element is germanium (Ge), thesecond element is antimony (Sb) and the third element is tellurium (Te).20. The method according to claim 18, wherein, when each of the firstphase change layer and the second phase change layer is formed of thebinary compound of the first element and the second element, the firstelement has a composition ratio of 0.1 to 0.9 in the phase change layer.21. The method according to claim 18, wherein, when each of the firstphase change layer and the second phase change layer is formed of thebinary compound of the first element and the third element, the firstelement has a composition ratio of 0.5 to 0.9 in the phase change layer.22. The method According to claim 18, wherein, when the first phasechange layer is formed of the binary compound of the second element andthe third element, the second element has a composition ratio of 0.4 to0.9 in the first phase change layer.
 23. The method according to claim18, wherein the phase change layer is formed through chemical vapordeposition or atomic layer deposition.
 24. The method according to claim18, wherein the first phase change layer and the second phase changelayer are formed at a low temperature equal to or lower than 200° C. 25.A method for manufacturing a phase change random access memory,comprising: forming a bottom electrode over a semiconductor substrate;forming a first phase change layer over the bottom electrode using aternary compound of a first element, a second element and a thirdelement; and forming a second phase change layer over a surface of thefirst phase change layer using a ternary compound of the first element,the second element and the third element.
 26. The method according toclaim 25, wherein the first element is germanium (Ge), the secondelement is antimony (Sb) and the third element is tellurium (Te). 27.The method according to claim 25, wherein, when each of the first phasechange layer and the second phase change layer is formed of the ternarycompound of the first element, the second element and the third element,the first element has a composition ratio of 0.01 to 0.5 in the phasechange layer, the second element has a composition ratio of 0.1 to 0.9in the phase change layer, and the third element has a composition ratioof 0.1 to 0.6 in the phase change layer.